Thermal Interface Material
Introduction
Thermal Interface Materials (TIMs) are essential thermal management solutions in electronic devices, specifically designed to enhance heat transfer between heat sources (such as CPUs, GPUs, and power transistors) and heat sinks. These materials fill the microscopic gaps and surface irregularities between the two, reducing thermal resistance and ensuring rapid and efficient conduction of heat from heat-generating components to cooling devices, thereby maintaining device stability and extending service life. They are widely used in various fields, including servers, automobiles, LED lighting, communication equipment, and consumer electronics.
| Product Name | Thermal Conductivity (W/m·K) | Thermal Resistance (°C-in²/W) | Operating Temperature Range (°C) | Flame Retardancy | Volume Resistivity (Ω·cm) & Dielectric Constant | |
|---|---|---|---|---|---|---|
|
EMI-Absorbing Thermal Silicone Pad
GTP-AM
|
1.5 ~ 5 | 0.845 ~ 0.413 | -40 ~ 150 | UL94 V-0 | ≧10¹² ~ 10¹⁴ / 12 ~ 20 | |
|
Non-Silicone Thermal Interface Pad
GTP-SF
|
2~3 | 0.3~0.7 (1mm,20psi) | -40 ~ 120 | UL94 V-1 | 7.3 ~ 10.14 | |
|
Thermal Conductive Silicone Pad
GTP
|
1~1.5 | 0.11~1.50 (1mm,20psi) | -40 ~ 150 | UL94 V-0 | 10¹⁰ ~ 10¹³ |