Thermal Interface Material
Introduction
Thermal Interface Materials (TIMs) are essential thermal management solutions in electronic devices, specifically designed to enhance heat transfer between heat sources (such as CPUs, GPUs, and power transistors) and heat sinks. These materials fill the microscopic gaps and surface irregularities between the two, reducing thermal resistance and ensuring rapid and efficient conduction of heat from heat-generating components to cooling devices, thereby maintaining device stability and extending service life. They are widely used in various fields, including servers, automobiles, LED lighting, communication equipment, and consumer electronics.
| Product Name | Thermal Conductivity (W/m·K) | Thermal Impedance (°C-in²/W, 1mm, 20psi) | ||||
|---|---|---|---|---|---|---|
|
EMI-Absorbing Thermal Silicone Pad
TP-AM
|
1.5 ~ 5 | 0.845 ~ 0.413 | -40 ~ 150 | UL94 V-0 | ≧10¹² ~ 10¹⁴ / 12 ~ 20 | |
|
Non-Silicone Thermal Interface Pad
TP-SF
|
2~3 | 0.3~0.7 (1mm,20psi) | -40 ~ 120 | UL94 V-1 | 7.3 ~ 10.14 | |
|
Thermal Conductive Silicone Pad
TP
|
1~1.5 | 0.11~1.50 (1mm,20psi) | -40 ~ 150 | UL94 V-0 | 10¹⁰ ~ 10¹³ |
| Photo | Product Name | Thermal Conductivity (W/m·K) | Thermal Impedance (°C-in²/W, 1mm, 20psi) | Tensile Strength (MPa) | Dielectric Breakdown Voltage (kV) | Density (g/cm³) | |
|---|---|---|---|---|---|---|---|
|
Fiberglass-Reinforced Thermal Insulation Pad
TC
|
1.6 ～ 8.0 | < 0.22 ～ < 0.61 | 11~20 , ASTM D412 | ≥ 3.6 ～ ≥ 6.0 | 1.52~2.8 , ASTM D792 | |
|
Synthetic boron nitride (BN) thermal film
DHP
|
≥ 50 W/m·K | - | - | > 40 kV/mm | 1.6 ± 0.1 g/cm³ | |
|
Thermal Insulation Materials
TCK
|
>4.0 ~ >6.0 | ≤0.28 ~ ≤0.35 | 9.5~34 | >4.0 ~ >6.0 | 2.5 |
| Photo | Product Name | Thermal Conductivity (W/m·K) | Thermal Impedance (°C-in²/W, 1mm, 20psi) | Viscosity (cps) | Working Time (hrs) @25°C (adjustable) | Density (g/cm³) | |
|---|---|---|---|---|---|---|---|
|
Two-part Thermally Conductive Gel
TF
|
1.2~12 | 0.19~0.3 | 200K ~ 3800K | 1~2 | 2.1~3.4 |
| Photo | Product Name | Thermal Conductivity (W/m·K) | Thermal Impedance (°C-in²/W, 1mm, 20psi) | Density (g/cm³) | Dielectric Breakdown Voltage (kV) | Long-Term Use Temperature (°C) | |
|---|---|---|---|---|---|---|---|
|
Two-part Thermally Conductive Potting Compound
GF
|
0.8 ～ 3.6 | 0.08~2.35 | 0.83~3.1 | 6~10 | -60 ～ 200 |
| Photo | Product Name | Thermal Conductivity (W/m·K) | Long-Term Use Temperature (°C) | Density (g/cm³) | Extrudability (g/min) | Penetration (GB/T 269) | |
|---|---|---|---|---|---|---|---|
|
Heat-conductive thermal putty
TM
|
2.0 ～ 14.5 | -60 ～ 200 | 2.9 ～ 3.3 | 0.49~20 | 160~280 |
| Photo | Product Name | Thermal Conductivity (W/m·K) | Long-Term Use Temperature (°C) | Penetration (GB/T 269) | Dielectric Breakdown Voltage (kV) | Volatile Content (%) (120°C, 24h) | |
|---|---|---|---|---|---|---|---|
|
Thermal Conductive Materials
TG
|
1.0 ～ 6.0 | -40 ～ 150 | 230~330 | 0.3~5.0 | 0.5~1.0 |
| Photo | Product Name | Phase Change Temperature (°C) | Thermal Conductivity (W/m·K) | Operating Temperature Range (°C) | Thermal Impedance °C-cm²/W 50psi @0.3mm | |
|---|---|---|---|---|---|---|
|
High-Performance Phase-Change Thermal Interface Material (PCM)
PCM
|
50 ～ 60 | 2 ～ 8.5 | -40~150 | 0.05 ～ 0.53 |