Thermal Insulation Materials
GTCK
Product Introduction
Thermal Insulation Materials
Engineered to meet the thermal management and insulation needs of electronic components, these materials combine excellent thermal conductivity with reliable dielectric strength. Depending on the application, they are available in both tape and pad formats, providing solutions for structural bonding and interface gap filling.
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Thermally Conductive Tape: A double-sided adhesive that bonds components while efficiently transferring heat.
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Thermally Conductive Pad: A flexible gap-filler designed to improve heat transfer by eliminating air gaps between surfaces.
Feature
- Thickness：0.15 ~ 0.20 mm
- Operating Temperature：-60 ~ 180℃
- Breakdown Voltage：>4.0 ~ >6.0 kV
- Volume Resistivity (Ω·cm)：10¹³ ~ 10¹⁴
- Thermal Resistance (50 psi, °C·in²/W)：≤0.28 ~ ≤0.35
These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.
Features
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