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Thermal Conductive Materials

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Product Introduction

Thermal Conductive Materials 

is a non-curing thermal interface material (TIM) composed of non-vulcanized silicone oil and thermally conductive fillers.

The grease-like paste does not cure and achieves very low bondline thickness (low BLT), wetting and conforming to micro-gaps between heat sources and heat sinks to reduce interfacial thermal resistance and improve overall heat dissipation. It supports screen printing or automated dispensing for high-throughput production and stable, repeatable assembly pressure.

  • High thermal conductivity, suitable for mid- to high-power devices

  • Low volatility & excellent wetting for long-term, crack-free interface contact

  • Wide environmental durability: temperature, humidity, and aging resistance

  • Metal-free options with high dielectric insulation to mitigate short-circuit risk

  • Process-friendly: compatible with screen printing and automated dispensing for high-volume manufacturing

Typical ApplicationsServers and data-center thermal modules; CPU/GPU/IGBT/MOSFET packages; PCB system modules; automotive electronics (e.g., OBC); PV inverters; high-power LED lighting; wireless/RF modules.

Feature

  • Thermal Conductivity (W/m·K): 1.0 – 6.0
  • Thermal Resistance (°C·cm²/W): ≤0.009 – ≤0.15
  • Density (g/cc): 2.3 – 3.3
  • Continuous Service Temperature (°C): −40 – 150

These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.

Features

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Specifications

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