is an advanced heat-spreading material engineered from nano-grade BN composites. It features a low dielectric constant, low dielectric loss, and excellent electromagnetic wave transparency, while providing high thermal conductivity, strong insulation, and superior heat resistance. With its flexibility and ease of processing, the film can be laminated with adhesive for seamless integration into electronic assemblies. It is widely used in RF chips, 5G millimeter-wave antennas, battery modules, and advanced electronic packaging that require efficient thermal management.
These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.
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