Two-part Thermally Conductive Potting Compound 

is a low-viscosity, silicone-based A/B system mixed at a 1:1 ratio. After mixing, it self-deaerates and cures at room temperature (RTV) to form a uniform, reliable elastomeric protective layer that provides dust and moisture protection, vibration damping, flame-retardant performance, sealing and adhesion, efficient heat transfer, and excellent gap-filling for potting/encapsulation. Available in multiple grades differentiated by thermal conductivity (W/m·K), it meets the thermal management and environmental protection needs of electronic assemblies and power modules. Typical Applications Automotive electronics: on-board charger (OBC), DC-DC converter, connectors, sensors, power amplifiers Industrial equipment: LED drivers, industrial power supplies, power converters, transformers, high-voltage resistor components"

• Thermal Conductivity (W/m·K): 0.8 – 3.6
• Viscosity (mPa·s / cP): 3,500 – 15,000
• Mix Ratio (A:B): 1:1
• Working Time (Pot Life, 25 °C / 77 °F): 1 – 6 hours
• Continuous Service Temperature: −60 – 200 °C (−76 – 392 °F)

These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.

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