EMI Shielding Materials
Introduction
The EMI Shielding Materials product line is specifically designed for institutional and industrial applications, providing efficient electromagnetic interference (EMI) shielding and thermal management solutions. It covers a wide range of fields, including consumer electronics, 5G infrastructure, electric vehicles (EV), medical devices, and aerospace. The product range includes conductive/shielding tapes, functional gaskets, wave-absorbing materials, and artificial graphite film series, meeting the dual demands of modern electronic devices for shielding and heat dissipation.
The EMI Shielding Materials product line is specifically designed for institutional and industrial applications, offering high-performance solutions for both electromagnetic interference (EMI) shielding and thermal management. This comprehensive range supports key industries such as consumer electronics, 5G infrastructure, electric vehicles (EV), medical devices, and aerospace.
The product portfolio includes conductive tapes, EMI shielding tapes, functional gaskets, wave-absorbing materials, and artificial graphite film series—engineered to meet the dual demands of shielding and heat dissipation in modern electronic devices.
| Photo | Product Name | Shielding Effectiveness | Surface Resistance | Thickness | Temperature | |
|---|---|---|---|---|---|---|
|
Conductive Fabric Double-sided Tape
CFD
|
60~70dB | ≦ 0.08~0.1 Ω/inch² | 0.03~0.12 mm | -20 ～ 85 °C | |
|
Conductive Fabric Tape (Single-Sided Adhesive)
CFS
|
60~70dB | ≤ 0.1 Ω/inch² | 0.02~0.2mm | -20 ～ 85 °C | |
|
Dual-Conductive Copper Foil Tape
CCD
|
≧70 dB | < 0.05 Ω/inch² | 20~80 μm | -40~100 ℃ | |
|
EMI Aluminum Foil Shielding Tape
ASTD
|
>70dB | ≤ 0.1（Adhesive） Ω/inch² | 0.06 ± 0.01 mm | -40 ～ 100 °C | |
|
EMI Nano Carbon Aluminum Foil
NGA
|
> 80 dB | - | 0.085 ± 0.01 mm | -40 ～ 100 °C | |
|
EMI Nano-Carbon Copper Foil
NGC
|
> 80 dB | - | 0.03~0.095 mm | -40 ～ 120 °C | |
|
High-Performance Thermal Interface Double-Sided Tape
HTCA
|
- | - | 0.10 ~ 0.25 μm | -30 ~ 130 ℃ | |
|
Nanocrystalline Ribbons
NAB
|
- | ≥130 μΩ·cm | Thickness: 35 μm (single layer), 155 μm (5 layers). | -40 ~ 110 °C | |
|
Single-sided copper foil tape
CCS
|
≧70 dB | < 0.05 Ω/inch² | 10 ~ 35 μm | -40 ～ 100 °C | |
|
|
Thermal Interface Double-Sided Tape
TCA
|
- | - | 0.1~0.025 μm | -45 ～ 150 ℃ |
| Product Name | Shielding Effectiveness | Surface Resistance | Thickness | Temperature | |
|---|---|---|---|---|---|
|
Conductive Non-Woven Double-Sided Tape
CWD
|
≧ 60 dB | ≦ 0.1 Ω/inch² | 0.06 ± 0.01 mm | -20 ～ 100 °C |
| Photo | Product Name | Thickness | Surface Resistance | Temperature | |
|---|---|---|---|---|---|
|
EMI 3D Conductive Foam
ECS
|
0.3 ~ 3.5 mm | ≦ 0.3 ~ 0.5 Ω/inch² | -20 ~ 85 ℃ | |
|
Fabric-over-foam conductive gaskets
CFG
|
0.02 ~ 0.1 mm | ≤ 0.07 Ω/inch² | -40 ~ 80 ℃ |
| Product Name | Thickness | Surface Resistance | Temperature | |
|---|---|---|---|---|
|
EMI Dual-Base 3D Conductive Foam
ECSD
|
0.3 ～ 3.5 mm | ≦0.2 Ω/inch² | -20 ～ 85 ℃ |
| Photo | Product Name | Thermal Conductivity | Thickness | Temperature | |
|---|---|---|---|---|---|
|
Graphite film
NPG
|
XY: 520 ~ 680 W/m·K | 0.1 ± 0.01 mm | -40 ~ 400 ℃ | |
|
High-Performance Synthetic Graphite Film
HPG
|
1300 ~ 2050 W/m·K | 17 ~ 50 μm | -40 ~ 400 ℃ | |
|
High-Performance Synthetic Graphite Pad
TFG
|
1000 ~ 2000 W/m·K | 1 to 20 mm (customizable) | -40 ~ 130 ℃ | |
|
Synthetic Graphite EMI Shielding Sheet
TFGE
|
2000 W/m·K | 1 to 20 mm (customizable) | -40 ~ 110 ℃ |
| Photo | Product Name | Key Features | Thickness | Density | Temperature | |
|---|---|---|---|---|---|---|
|
EMI Absorber Sheet
AB
|