Non-silicone thermal interface pads

 are specially formulated for applications sensitive to silicone contamination. Unlike conventional silicone-based materials, the non-silicone composition prevents siloxane outgassing and silicone oil migration, making it ideal for use around optical, electronic, and medical precision components.

• Stable Thermal Performance: Delivers consistent thermal conductivity up to 2–3 W/m·K.

• Reliable Mechanical Properties: High compressibility, tear resistance, and dimensional stability allow for multiple reworks and tolerance to high-frequency vibration and impact.

• Easy Installation:Excellent tackiness with optional single- or double-sided release liners for flexible assembly needs.

• Long-Term Durability: Resistant to aging and degradation over time, ensuring reliable long-term performance.

• Thermal Conductivity (W/m·K): 2–3
• Thermal Resistance (°C·in²/W, 1mm @ 20 psi): 0.3–0.7
• Dielectric Breakdown Voltage (kV): ≥6.0
• Volume Resistivity (Ω·cm): 1.5 × 10¹⁰ to 10¹¹
• Thickness (mm): 1.0–10.0
• Hardness (Shore OO): 45–50
• These are typical values and can be customized upon request. Please contact us for more details.

These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.

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