Thermal Conductive Silicone Pad
GTP
Product Introduction
Thermal Conductive Silicone Pad
are engineered interface materials that combine efficient thermal conductivity with excellent compressibility, making them ideal for enhancing heat dissipation and protecting electronic components.
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High Thermal Conductivity: Effectively transfers heat from components such as chips, ICs, and power modules to heat sinks or metal enclosures.
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Gap Filling Capability: Conforms to uneven surfaces, compresses under pressure to eliminate air gaps, and reduces thermal contact resistance.
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Soft and Compressible: The elastic nature of the material helps absorb assembly stress and ensures consistent surface contact between interfaces.
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Environmental Durability: Withstands a wide range of temperatures and meets flame retardancy requirements, making it suitable for long-term use in demanding electronic applications.
Feature
- Thermal Conductivity (W/m·K): 1 ~ 15
- Thermal Impedance (°C-in²/W, 1mm, 20psi): 0.11 ~ 1.50
- Thickness (mm): 0.4 ~ 6.5
- Hardness (Shore OO): 20 ~ 65
- Continuous Operating Temperature (°C): -40 ~ 150
These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.
Features
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Specifications
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