Heat-conductive thermal putty
GTM
Product Introduction
Heat-conductive thermal putty
is a high-thermal-conductivity, silicone-based thermal interface putty with excellent moldability and flow. It conforms under low assembly pressure to fill gaps between heat sources and heat sinks, reducing interfacial thermal resistance and improving overall heat dissipation.
Depending on process needs, it is available as pre-formed (preform) parts or semi-flowable grades, and can also be made into high-compressibility sheets. It supports automated dispensing to significantly improve assembly throughput and consistency.
Feature
- Thermal Conductivity (W/m·K): 2.0 – 14.5
- Thermal Resistance (°C·cm²/W): 0.04 – 0.31(≈ 0.26 – 2.00 °C·in²/W for U.S. customary area)
- Density (g/cm³): 2.9 – 3.3
- Continuous Service Temperature: −60 – 200 °C (−76 – 392 °F)
- Dielectric Strength: 4.0 – 8.0 kV/mm
These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.
Features
| {{ typeOne.merge }} |
|---|
| {{ itemOneTitle }} |
| {{ item }} |
Specifications
| {{ typeTwo.merge }} |
|---|
| {{ itemTwoTitle }} |
| {{ item }} |
| {{ typeThree.merge }} |
|---|
| {{ itemThreeTitle }} |
| {{ item }} |