EMI Nano-Carbon Copper Foil 

is a high-performance composite material engineered for thermal management and electromagnetic interference (EMI) shielding. It features a conductive copper foil laminated with a nano-carbon thermal dissipation layer, offering superior thermal conductivity, low surface resistance, and effective EMI suppression across a broad frequency range.

This material is lightweight, heat-resistant, and flexible enough for bending, lamination, and die-cutting, making it ideal for compact, high-density electronic assemblies.

It is widely used in high-speed data cables, LCD panels, IC packaging, PCBs, chips, and other electronic components requiring both efficient heat dissipation and EMI protection in space-constrained environments.

• Thickness Range: 0.03 – 0.095 mm
• Thermal Conductivity: ≧640 – ≧730 W/m·K
• Thermal Diffusivity Coefficient: ≧100 – ≧150 mm²/s
• Tensile Strength: ≧220 – ≧580
• Operating Temperature Range: -40 ~ 120 ℃