is a high-performance EMI/RFI shielding material designed to address both high- and low-frequency interference. It offers low surface resistance, stable grounding, and ESD discharge capability, enhancing overall EMC for electronic assemblies. The fabric surface provides abrasion resistance and excellent convertibility, enabling tight lamination to housings and metal parts to improve product stability.
Low resistance path for reliable conductivity and fast ESD bleed-off
High EMI/RFI shielding effectiveness to isolate internal/external noise
Converter-friendly: ideal for die-cutting, lamination, bending/folding
Abrasion-resistant, high adhesion; bonds well to diverse substrates
Smartphones, tablets, FPC flex circuits, rigid PCBs, automotive electronics, shielding cans/covers, and other assemblies requiring EMI/ESD control.
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