EMI Dual-Base 3D Conductive Foam 

is engineered for XYZ omni-directional conductivity with enhanced Z-axis EMI shielding and reliable electrical transmission across all directions. Its dual-layer design improves abrasion resistance, compression resilience, and cushioning performance, making it ideal for gap filling, structural support, and mechanical shock absorption. The foam effectively suppresses EMI/RFI interference and provides ESD grounding protection, ensuring long-term reliability of electronic systems. Typical applications include smartphones, tablets, gaming consoles, smart home devices, drones, ICs, PCBs, and display modules, with multiple thickness options available for diverse design requirements.

• Thickness: 0.3 ～ 3.5 mm
• Surface Resistance: ≦0.2 Ω/inch²
• Z-Axis Resistance: ≦0.2 Ω/inch²
• Shielding Effectiveness: >60 dB (30 MHz ～ 6 GHz)
• Operating Temperature Range: -20 ～ 85 ℃