Thermal Interface Double-Sided Tape 

is designed for heat sink attachment and electronics cooling applications, offering strong bonding with low thermal impedance for efficient heat transfer. Engineered with excellent thermal conductivity, high reliability, and process-friendly handling, this tape ensures both effective thermal management and secure mechanical fixation. It is widely used in power supplies, LED lighting, LCD modules, PCBs, and controllers, providing a dependable solution for long-term electronics cooling and assembly requirements.

• Thickness: 0.10 ± 0.02 mm ～ 0.25 ± 0.03 mm
• Thermal Conductivity: ≧1 W/m·K
• Thermal Impedance: 0.68 ～ 0.96 ℃·in²/W
• Breakdown Voltage: >800 ～ >2500 Vac
• Operating Temperature Range: -45 ～ 150 ℃