High-Performance Thermal Interface Double-Sided Tape 

is engineered for thermal management in processors and high-power semiconductors, providing strong adhesion and low thermal impedance for efficient heat transfer and reliable mechanical fixation. Built with high-density materials, it ensures long-term stability while being easy to process and apply. Common applications include power supplies, LED lighting, LCD displays, heat sink attachment, and PCB or controller assemblies, delivering enhanced cooling efficiency and consistent performance across demanding electronic systems.

• Thickness: 0.10 ± 0.02 mm ～ 0.25 ± 0.03 mm
• Thermal Conductivity: 1.5 W/m·K
• Breakdown Voltage: >2500 ～ >4000 Vac
• Peel Adhesion: >900 gf/20 mm
• Operating Temperature Range: -30 ～ 130 ℃