EMI 3D Conductive Foam 

delivers omni-directional conductivity with excellent compression set resistance, cushioning, and impact absorption. Engineered for ease of fabrication and integration, it is ideal for gap filling, mechanical support, and component protection in electronic assemblies. The material provides consistent EMI shielding and reliable ESD grounding performance. Commonly used in smartphones, tablets, smart wearables, servers, IC packaging, PCBs, and EMI shielding modules, this foam effectively mitigates electromagnetic interference and enhances device reliability. Featuring high EMI/RFI shielding effectiveness, static dissipation, and robust mechanical damping, EMI 3D Conductive Foam is available in a variety of thicknesses to accommodate diverse design and assembly requirements.

• Thickness: 0.3 ～ 1.5 mm
• Surface Resistance: ≦0.3 Ω/inch²
• Z-Axis Resistance: ≦0.2 Ω/inch²
• Shielding Effectiveness: >60 dB (30 MHz ～ 6 GHz)
• Operating Temperature Range: -20 ～ 85 ℃