High-Performance Synthetic Graphite Pad 

is engineered for efficient heat dissipation in high-power electronic components. Combining excellent thermal conductivity, electrical insulation, and EMI shielding, it effectively replaces traditional materials such as silicone pads, mica, or ceramics. With strong mechanical durability and compressibility, it offers cushioning, shock absorption, and long-term reliability. Easy to customize and assemble, it’s ideal for smartphones, tablets, GPUs, ICs, servers, and power modules requiring high-efficiency thermal management.

• Thermal Conductivity of Substrate: 1000 ～ 2000 W/m·K
• Available Width Range: 2.5 mm ～ 25 mm
• Available Length Range: 5 mm ～ 500 mm
• Operating Temperature Range: -40 ～ 130 ℃
• Recommended Compression Range: 15% ～ 35% (<2 mm thick); 20% ～ 50% (>2 mm thick)