3521 Low Temperature Epoxy Adhesive

 is a high-performance adhesive specifically developed for electronic components, particularly suitable for precision assembly of memory cards, CCD/CMOS sensors, and fingerprint recognition modules. Its low viscosity and fast-curing capability make it ideal for applications requiring high reliability.

• Color: White
• Viscosity: 8–20 mPa·s
• Density: 1.33 g/cm³
• Recommended Curing Condition: 5 minutes @ 80°C
• Glass Transition Temperature (Tg): Pre-cure 51°C
• Shear Strength: 18 MPa
• Storage Conditions: -25 to -15°C