3510 Low Temperature Epoxy Adhesive

  is a high-performance epoxy formulated specifically for electronic components, especially suitable for precision assembly such as memory cards, CCD/CMOS sensors, and fingerprint recognition modules. With a low glass transition temperature, strong adhesion, and low-temperature heat curing, it delivers reliable performance in high-reliability applications.

• Color: Black
• Viscosity: 7,000–27,000 mPa·s
• Density: 1.6 g/cm³
• Recommended Curing Condition: 20 minutes @ 80°C
• Glass Transition Temperature (Tg): Pre-cure 45°C
• Coefficient of Thermal Expansion: Pre-cure 40×10⁻⁶ / Post-cure 130×10⁻⁶
• Shear Strength: 21 MPa
• Storage Conditions: -25 to -15°C