3190 Low Temperature Epoxy Adhesive
3190
Overview
3190 Low Temperature Epoxy Adhesive
is a high-performance resin formulated for rapid curing at low temperatures and excellent heat resistance. With high viscosity, fluorescence, and outstanding shear strength, it is ideal for structural bonding of electronic components.
Features
- Color: Black
- Viscosity: 27,750 mPa.s
- Density: 1.3 g/cm³
- Recommended Curing Condition: 1 hour @ 100°C
- Glass Transition Temperature (Tg): 135°C
- Shear Strength: 39 MPa
- Storage Conditions: -25 to -15°C
Product Overview
| Model | Color | Viscosity (mPa·s) | Density (g/cm³) | Recommended Curing | Glass Transition Temp (Tg °C) | CTE (K⁻¹) | Shear Strength (MPa) | Storage Condition |
|---|---|---|---|---|---|---|---|---|
| 3190 | Black | 27750 | 1.3 | 1h@100℃ | 135 | － | 39 | -25～-15℃ |
| 3510 | Black | 7000–27000 | 1.6 | 20min@80℃ | 45 | Before Tg: 40×10⁻⁶ After Tg: 130×10⁻⁶ |
21 | -25～-15℃ |
| 3520 | Black | 10000–20000 | 1.45 | 5–10min@80℃ | 35 | Before Tg: 55×10⁻⁶ After Tg: 162×10⁻⁶ |
≥13 | -25～-15℃ |
| 3521 | White | 8–20 | 1.33 | 5min@80℃ | 51 | － | 18 | -25～-15℃ |
Features
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Specifications
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