3520 Low Temperature Epoxy Adhesive

  is a high-performance adhesive formulated for electronic components, particularly well-suited for precision assembly such as memory cards, CCD/CMOS sensors, and fingerprint recognition modules. With medium viscosity, excellent adhesion, and low-temperature heat curing, it delivers reliable performance in high-reliability applications.

• Color: Black
• Viscosity: 10,000–20,000 mPa·s
• Density: 1.45 g/cm³
• Recommended Curing Condition: 5–10 minutes @ 80°C
• Glass Transition Temperature (Tg): Pre-cure 35°C
• Coefficient of Thermal Expansion (CTE): Pre-cure 55×10⁻⁶ / Post-cure 162×10⁻⁶
• Shear Strength: ≥13 MPa
• Storage Conditions: -25 to -15°C