8313 Underfill Epoxy Adhesive

 is specifically developed for chip-scale packaging (CSP) and BGA applications. With an ultra-low coefficient of thermal expansion (CTE), it significantly reduces package stress after curing, enhancing overall reliability and durability. Its outstanding impact resistance and moisture-thermal aging performance ensure stable protection even under harsh environmental conditions. Ideal for high-density electronic assemblies.

• Color: Black
• Viscosity: 20,000 mPa·s
• Density: 1.55 g/cm³
• Hardness: 86D Shore
• Glass Transition Temperature (Tg): 120°C
• CTE Before Tg (α1): 15 ppm/°C
• CTE After Tg (α2): 70 ppm/°C