8308 Underfill Epoxy Adhesive

 is specifically designed for chip and BGA (Ball Grid Array) packaging. Featuring ultra-low viscosity, it quickly flows into microscopic gaps for precision underfill applications. Highly compatible with lead-free solder, it cures to deliver excellent electrical insulation and high hardness, significantly enhancing thermal cycling durability and mechanical strength of electronic components. Ideal for high-density packaging and modern electronics manufacturing, it offers reliable protection for semiconductors and communication modules.

• Color: Black
• Viscosity: 320 mPa·s
• Density: 1.15 g/cm³
• Hardness: 90D Shore
• Glass Transition Temperature (Tg): 113°C
• Coefficient of Thermal Expansion (CTE) Before Tg: 171 K⁻¹
• Coefficient of Thermal Expansion (CTE) After Tg: 55 K⁻¹