Mostly the traditional packaging process is high-pressure injection. Compared with the low-pressure injection process, it is with high injection pressure and high injection temperature. And during the injection process, some fragile or precision components are easily damaged which leads to a high defect rate in the production process.
|Traditional Insert Molding
|● High injection pressure (350-1300Bar)
|● Low injection pressure (1.5-40Bar)
|● High injection temperature (230-300℃)
|● Low injection temperature (180-230℃)
|● The mold can only be made of steel because the traditional insert molding has high abrasion on the mold.
|● The mold is allowed to be made of a variety of materials without hurting the mold.
|● Not allowed to inject on precision electronic components
|● A great packaging process for precision components
|● Generally, engineering plastics have poor viscosity with different materials
|● Good adhesion between injection materials and products, and with good waterproof sealing performance
As shown in the above table, in order to solve the problems caused by injection pressure, our engineers selected low-pressure injection hot-melt adhesive products with low viscosity, and high fluidity after melting. After polyamide is melted, only needs a low pressure to make it flow into a small mold space, so low-pressure injection will not damage the fragile or precision components that need to be packaged. Therefore, using Low-pressure injection will greatly reduce the defect rate.
In terms of injection temperature, the injection temperature of the low-pressure injection molding process is also lower than the traditional high-pressure injection temperature, thus reducing the probability of damaging sensitive and precision components when the temperature is too high.
In terms of cost, because the pressure of low-pressure injection is low, and the abrasion on the mold is very small, the low-pressure molding mold can be made of cast aluminum mold instead of steel, which is very easy to process and develop and can greatly shorten the development time.
In terms of function, the low-pressure injection hot-melt adhesive has excellent sealing performance. Because engineering plastics usually cannot be combined with each other materials and has no waterproof function, the low-pressure injection hot-melt adhesive has good viscosity for different materials. And if used on suitable products design, the low-pressure injection hot-melt adhesive is easy to help the products to meet IP67 or even higher waterproof requirements.
All of the above characteristics tell us that low-pressure injection molding technology can make up for the shortcomings of traditional high-pressure injection molding, and become the best solution for small electronic and electrical components, providing mechanochemical protection with long-term reliability to reduce costs, and improving benefits.