Hot Melt Adhesive
Low pressure molding Hot Melt Adhesive is a one-component thermoplastic polyamide resin, which is designed to meet the requirements of low pressure molding. This product is non-corrosive and odorless. It provide impressive device protections against temperature, vibration, impact, moisture, chemicals and mechanical stress. Its flammability rating meets UL94 V-0, RoHS, REACH, Halogen free standard.
- Color : 8878(Black)/8878A(Amber)
- Package : 20kg/Bag
- Melting Temperature : 200~240℃
- Viscosity : @210°C=4500(mPa·s) @220°C=3000(mPa·s)
- UL, RoHS, REACH, Halogen Free