3190 Low Temperature Epoxy Adhesive
2590
Overview
3190 Low Temperature Epoxy Adhesive
is a high-performance resin formulated for rapid curing at low temperatures and excellent heat resistance. With high viscosity, fluorescence, and outstanding shear strength, it is ideal for structural bonding of electronic components.
Features
- Color: Black
- Viscosity: 27,750 mPa.s
- Density: 1.3 g/cm³
- Recommended Curing Condition: 1 hour @ 100°C
- Glass Transition Temperature (Tg): 135°C
- Shear Strength: 39 MPa
- Storage Conditions: -25 to -15°C
Silicone Gasketing Sealant Specifications
| Model | Color | Extrusion Rate g/min |
Density g/cm³ |
Tack-Free Time min |
Hardness Shore |
Tensile Strength MPa |
Elongation at Break % |
Operating Temperature ℃ |
|---|---|---|---|---|---|---|---|---|
| 2590 | Black | NA | 1.35 | 5–8 | 30–50A | ≥2 | ≥300 | -50 to 200 |
| 2596 | Red | ≥250 | 1.3 | 20 | 34A | 3.2 | 290 | -50 to 250 |
| 2598 | Black | ≥220 | 1.2–1.4 | ≤30 | 26–40A | ≥1.5 | ≥300 | -50 to 210 |
| 2599 | Gray | 50–200 | 1.45 | ≤30 | 45–75A | ≥2.4 | ≥100 | -60 to 260 |
Features
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Specifications
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