SikaBiresin RE896 Epoxy Resin Potting Compound

, featuring rapid heat-curing properties, solidifies quickly at high temperatures, streamlining production efficiency while delivering reliable sealing. Its exceptional thermal conductivity efficiently dissipates heat, ensuring components maintain an appropriate temperature. Capable of withstanding mechanical compression and expansion, it ensures integrity under various stresses, thus extending product life.

• Material: Epoxy Resin
• Mixed viscosity, at 25 ℃：-mPa.s
• Pot life, at 25 ℃：60/70℃min
• Shore hardness：D 90
• Max operating temperature：180℃
• Thermal conductivity：1W/m.K
• Color：Black