Low pressure molding Hot Melt Adhesive is a one-component thermoplastic polyamide resin, which is designed to meet the requirements of low pressure molding. This product is non-corrosive and odorless. It provide impressive device protections against temperature, vibration, impact, moisture, chemicals and mechanical stress. Its flammability rating meets UL94 V-0, RoHS, REACH, Halogen free standard.

• Color : 8846(Black)/8846A(Amber)
• Package : 20kg/Bag
• Melting Temperature : 200~240℃
• Viscosity :
  @200°C=6500(mPa·s)
  @210°C=5500(mPa·s)
  @220°C=4500(mPa·s)